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    2012년 디지털 컨버전스(융합) 글로벌 혁신기술 종합분석

    9788966670420.jpg

    도서명:2012년 디지털 컨버전스(융합) 글로벌 혁신기술 종합분석
    저자/출판사:BIR,Research,Group/비아이알
    쪽수:3000쪽
    출판일:2012-06-01
    ISBN:9788966670420

    목차
    제 1장 2012년 디지털 컨버전스(융합) 글로벌 혁신기술 종합분석

    1. 2012년 디지털 컨버전스(융합) 글로벌 혁신기술 종합분석

    1-1. 3Plus1 Technology, First-Generation Programmable Multicore CoolEngines

    1-2. Abilis Systems, OFDM Demodulator

    1-3. Abilis Systems, OFDM Demodulator

    1-4. mixed-signal system-on-a-chip and multimedia digital signal processing

    1-5. Actions Semiconductor Co

    1-6. New generation of video technology - Advanced Media Video-AMV3.0

    1-7. Advantest Corporation

    1-8. Advantest Corporation, T2000 Test System

    1-9. Advantest Corporation, T2000 SoC Test Platform

    1-10. Advantest Corporation, New Low-Cost Consumer Device SoC Test Solution

    1-11. Advantest, T2000 open-architecture SoC Test System

    1-12. proprietary or standard communications protocols including antennas, complete RF

    1-13. AeroComm Inc., ZB2430 "ZigBee Your Way(TM)" Transceiver

    1-14. Agilent Technologies Inc., Latest Genesys Software Enhances RF System Design

    1-15. Signal Processing Libraries for 802.11ac WLAN and 60-GHz 802.11ad

    1-16. Agilent Technologies Inc., Percello's Aquilo Femtocell System-on-a-Chip(SoC)

    1-17. Agilent Technologies Inc., GoldenGate software for Advanced RFIC Development

    1-18. Berkeley Design Automation Analog FastSPICE™ Platform for HD CMOS Image Sensors

    1-19. AltaSens, Inc., WDR CMOS imaging solution

    1-20. AltaSens, Inc., BitsDReam(TM) Technology

    1-21. Altior, New AltraFlex™ Compression Decompression File System (CeDeFS) Accelerator Solution

    1-22. Altior, Software Development Kit for Hardware-Accelerated Data Compression for Web Servers

    1-23. Ambarella Inc., Next Generation of Digital Still Cameras with 1080p60 Fluid Motion Video

    1-24. Ambarella Inc., A7 IP Camera SoC

    1-25. Ambarella Inc., iOne Camera Applications Processor Enables a New Class of Android™

    1-26. Ambarella Inc., A1 digital camera platform

    1-27. A7 system-on-chip (SoC) for high-resolution video and image quality in consumer HD cameras

    1-28. AMI Semiconductor, Platform Solutions for Next Generation Computing Products

    1-29. power and noise solutions for Chip-Package-System (CPS) convergence

    1-30. Apache Design Solutions, Platform solutions for Chip-Package-System convergence

    1-31. Applied Materials, Inc., New Innovations for Cutting-Edge Chip Designs

    1-32. Applied Micro Circuits Corporation, world's first embedded processing SoC

    1-33. Next-generation PacketPro(TM) Multicore Processor System-on-a-Chip (SoC) Family

    1-34. Dual-core Titan, Software Compatible with AMCC's PowerPC(TM) 440 family

    1-35. Aptina, CMOS image sensor solutions; new ASX340AT system-on-chip (SOC)

    1-36. Aptina, Native 1080p System on Chip Solution for High Definition Video Imaging Applications

    1-37. Aptina, SOC Imaging Solution for 720P/30fps HD Video

    1-38. Aptina, Automotive-Grade Imaging SOC

    1-39. Aptina, A-Pix Technology

    1-40. Aptina Imaging, 5-Megapixel SoC

    1-41. Arada Systems, 802.11p Telematics System With First DSRC SD Card Operating at 5.9GHz

    1-42. Arada Systems, WLAN-Based RFID Solution

    1-43. ARC International plc, Virtual Bass™ Audio Enrichment Solution

    1-44. ARC International plc, Configurable processors and multimedia subsystems

    1-45. ARC International, Dynamic Adaptive Encoding

    1-46. ArchPro, Next-Generation Multi-Voltage Verification Solution

    1-47. Arkados, convergent digital home networking

    1-48. Arkados, HomePlug AV System-on-Chip

    1-49. Arkados, Direct-to-Speaker(tm) Internet Radio Reference Design

    1-50. Arkados, System-on-Chip Powers Digital Audio

    1-51. ARM, ARM? Processor Optimization Pack™ (POP) solutions for TSMC 40nm and 28nm process

    1-52. ARM, ARM Cortex™-A9 MPCore™ Processors and Mali™-400 MP GPUs

    1-53. ARM, Next-Generation Security For Services Running On Connected Devices

    1-54. ARM, Mali(TM) graphics processor architecture

    1-55. ARM, Ultra Low-Power Physical IP Technology

    1-56. ARM, Mali(TM)-200 and Mali-55 cores

    1-57. Aristos Logic, Multi-Protocol RAID Storage Processor Device

    1-58. network-on-chip(NoC) interconnect IP solutions; FlexLLI MIPI Low Latency Interface(LLI) IP

    1-59. MIPI Alliance Low Latency Interface (LLI) 1.0 interchip communication specification

    1-60. Arteris SA, Network-on-Chip (NoC)

    1-61. Arteris, SystemC Transaction Level Models (TLM)

    1-62. AsicAhead NV, AA1001 Worldwide WiMAX Radio

    1-63. AsicAhead NV, Breakthrough Single-Chip Programmable Radio

    1-64. Atheros Communications, Inc., End-to-End 10G EPON Platform

    1-65. Align Technology Leveraging 802.11n 1-Stream Specification; 802.11nmedia access control

    1-66. Atheros Communications, Inc., Wireless System-on-a-chip(WiSoC)

    1-67. Aviza Technology, Inc., Next-generationatomic layer deposition (ALD) system

    1-68. Avnera Corporation, Analog System-on-Chip (ASoC) technology for consumer electronics

    1-69. Avnera Corporation, Multipoint HD Wireless Audio Platform

    1-70. Avnera Corporation, Flagship AudioMagic Chips

    1-71. Avnera Corporation, "Wired-Quality" Wireless Music and Voice Chip Technology

    1-72. AXCESS International Inc., Dual-active RFID technology

    1-73. Axxcelera Broadband Wireless, Sequans System on Chip (SoC)

    1-74. First Complete Lab-on-a-Chip System Based on Printed Semiconductor Technology

    1-75. Bluespec high-level synthesis toolset for development of system-on-a chip (SoC) designs

    1-76. Bluespec, Inc., Bluespec high-level synthesis toolset

    1-77. Broadcom Corporation, lndustry's first 40nm dual-core hybrid gateway system-on-a-chip (SoC)

    1-78. Broadcom Corporation, Six system-on-a-chip (SoC) MoCA 2.0 products

    1-79. Industry’s First SoC to Achieve 1.25Gbps for 4G/LTE Microwave Backhaul

    1-80. Broadcom Corporation, Satellite set-top box (STB) system-on-a-chip (SoC) solution

    1-81. Broadcom Corporation, Breakthrough '3G Phone-on-a-Chip' Processor

    1-82. Processor technology with Realtek’s rich-featured Ethernet switching technology

    1-83. BroadLight, BroadLights BL2000 ONT System on Chip (SoC)

    1-84. Cadence Design Systems, Inc., Advanced-Node Digital Technology

    1-85. New Interface Verification IP for Development of Cloud Infrastructure

    1-86. design intellectual property(IP) for the LPDDR3 mobile memory standard

    1-87. Cadence Design Systems, Inc., Breakthrough 32nm HD Digital Camera SoC for Ambarella

    1-88. Cadence Design Systems, Inc., New Cadence Allegro Technology

    1-89. Cadence Design Systems, Inc., Cortex-A15 processor-based SoCs

    1-90. Electronic System-Level (ESL) hardware design and power optimization

    1-91. Calypto Design Systems, Automated Tool for Memory Power Optimization

    1-92. Accurate Arteris FlexNoC Interconnect Models for Carbon SoCDesigner Plus

    1-93. Carbon Design Systems, Advanced Microcontroller Bus Architecture Advanced eXtensible

    1-94. Carbon Design Systems, High-performance virtual system prototyping solution

    1-95. Cavium, Inc., First SoC with Breakthrough Search Processing and Over 100G bps Single-chip

    1-96. Cavium, Inc., next-generation version of its ARM11-based Econa SoCs

    1-97. Next Generation OCTEON(TM) II Multi-Core MIPS64(R) Internet Application Processor

    1-98. CebaTech, Advanced network and storage embedded systems solutions

    1-99. CebaTech Inc, Breakthrough ESL technology

    1-100. Celeno Communications, Semiconductors for multimedia Wi-Fi home networking

    1-101. Celeno Communications, Wireless Set-Top Box Platforms

    1-102. Celeno Communications, video-grade Wi-Fi chipset

    1-103. Celeno Communications, WiFi System on a Chip

    1-104. Centillium Communications, Inc., eXtremeVDSL2 System-on-a-Chip Solution

    1-105. Centillium Communications, Inc., Entropia VoIP Solution

    1-106. Chipcon AS, ZigBee(TM) Compliant System-on-Chip Solutions

    1-107. Chipcon AS, CC1110 System-on-Chip (SoC) solution

    1-108. Chipidea, Next-Generation USB IP

    1-109. Christie, Brilliant3D(TM) technology

    1-110. ClariPhy Communications Inc., LightSpeed, industry’s first single-chip 40G coherent SoC

    1-111. Cobra Digital, Cobra PET Portable Media Player

    1-112. Commex Technologies Ltd., Vulcan family of NICs - the Vulcan SP HT6210

    1-113. Digital signage-oriented system-on-chip (SoC) with Linux and Android development support

    1-114. Conexant Systems, Inc., New System-on-Chip (SoC) Controller

    1-115. 통해 차세대 Triple-Play Services를 가능하게 하는 혁신적 Controllers

    1-116. Coresonic AB, Breakthrough DSP architecture for wireless baseband

    1-117. Coresonic AB, Multimode Wireless Modems

    1-118. Coronis Systems

    1-119. Next Generation Ultra-Low-Power, Long Range Wavenis System-on-Chip Solution

    1-120. CoWare, Comprehensive ESL Design Environment

    1-121. Crocus Technology, System-On-Chip Solutions Based on Magnetic-Logic-Unit™ (MLU) Technolog

    1-122. Crocus Technology, Smart Cards Based on Magnetic-Logic-Unit™ (MLU) Technology

    1-123. Crocus Technology, Thermally Assisted Switching (TAS)-based MRAM Technology

    1-124. CPU Technology, Inc., Embedded Operating System

    1-125. CPU Technology, Inc., SuperQ X3(TM)

    1-126. CSR plc, Most Highly Integrated Processors for Printers

    1-127. CSR plc, DirectOffice™ Mobile Print 3.0

    1-128. CSR plc, SiRFatlasV™ Multifunction SoC Platform

    1-129. CSR plc, Auto-qualified SoC Product, Breakthrough Connected Infotainment Solution

    1-130. CSR, leading edge 40nm low power RF CMOS technology IP

    1-131. Cypress Semiconductor Corp., TrueTouch? Single-Layer Sensor Solution Drives Touchscreen

    1-132. Revolutionary PSoC Creator™ Design Environment for the PSoC? 3 and PSoC 5 programmable

    1-133. Cypress Semiconductor Corp., New PSoC? Solution for Digital Filters

    1-134. Cypress Semiconductor Corp., EZ-Color(TM) HBLED Controller Family

    1-135. Cypress Semiconductor Corp., High-performance, Mixed-signal, Programmable solutions

    1-136. Cypress Semiconductor Corp., PSoC(R) Mixed-Signal Array

    1-137. D2 Technologies, Embedded IP communications software platforms

    1-138. D2 Technologies, Solutions for VoIP and IP Communications over WiMAX

    1-139. DAFCA Incorporated, Leading Edge SoC Verification Solutions

    1-140. Datacard Group, SIM Card Personalization System

    1-141. DecaWave, ultra wideband (UWB) technology for Real Time Location Systems (RTLS)

    1-142. DecaWave, Real Time Location Systems(RTLS)

    1-143. Denali Software, Inc., DDR SDRAM Controller IP and PHY Solution

    1-144. Denali Software, Inc., LPDDR2 SDRAM Controller IP For High-Performance, Low-Power SoC

    1-145. Denali Software, Inc., MMAV 2008 Verification IP

    1-146. Denali Software, Inc., PureSpec(TM) Verification Software

    1-147. Dialog Semiconductor Plc, VoIP IC family to address high end phones

    1-148. Dialog Semiconductor Plc, VOIP technology adopted by VTech for S-series desktop phones

    1-149. Dialog Semiconductor Plc, DA6011 power management IC

    1-150. Digium, Inc., award-winning Unified Communications (UC) system

    1-151. Digium, Inc., Advanced Asterisk Based VoIP Gateways

    1-152. Digium, Inc., Switchvox-Unified-Communications-Solution

    1-153. Digium, Inc., VoiceBus(TM) Technology

    1-154. DivX, Inc., World’s First DivX Plus? HD System-on-Chip

    1-155. DivX, Inc., World's First DivX Certified Blu-ray Chip

    1-156. Wireless chipset solutions for converged communications at home and office

    1-157. DSP Group, Inc., VoIP Chipset Powers Gigaset DECT IP Multicell System

    1-158. DSP Group, Inc., DECT Chipset Family; DCX81 Revolutionary Advanced SoC

    1-159. DSP Group, Inc., XpandR platform

    1-160. Dynamic Card Solutions, CardWizard? Software

    1-161. Dynamic Card Solutions, CardWizard software

    1-162. ECS EliteGroup, Mobile WiMAX/EDGE Device

    1-163. Emulex Corporation, intelligent I/O management application

    1-164. Emulex Corporation, 10GBASE-T Connectivity for its OneConnect™ UCNAs

    1-165. Emulex Corporation, InSpeed SOC 422

    1-166. ENSPERT, Mobile TV Reception Chip, Android Tablet Player and Mobile TV Router Solution

    1-167. EnCentrus Systems Inc., Next generation OpenCable(TM) products

    1-168. Enea, Realtime and Linux Implementations in Next Generation Networking Infrastructure

    1-169. Enea, Optima Tools to Support Heterogeneous Multicore and Linux

    1-170. Enea, OSE Real-Time OS

    1-171. ESI, New esiFIT Module for Advanced Microfabrication

    1-172. ESI, Thin-Film-on-Silicon (TFOS) Laser Trimming Systems

    1-173. eSilicon Corporation, High-Performance Network Chips

    1-174. eFlex™ content-addressable memory (CAM) cores and eFlexCAM™ compilers

    1-175. Faraday Technology Corporation, ASIC Design Service for ARM? Cortex™-A9 Processors

    1-176. Faraday Technology Corporation, Strengthen IP Alliance for Advanced Nodes

    1-177. Faraday Technology Corporation, Low Power Mobile Platform

    1-178. Firetide, Inc., FWC 1000 and FWC 2000, Two New Wireless LAN (WLAN) Controllers

    1-179. Firetide, Inc., New MIMO Technology

    1-180. FormFactor, Inc., SmartMatrix™ 100XP™ probe solution

    1-181. FormFactor, Inc., New MEMS probing contact technology

    1-182. Fortinet, FortiWifi(TM)-60C - new multi-threat security appliances

    1-183. Freescale Semiconductor, Kinetis 32-bit microcontroller portfolio

    1-184. Industry’s first system-on-chip two-way radio enabling cost effective

    1-185. Freescale Semiconductor, Breakthrough MSC7120 SoC

    1-186. Fresco Microchip Inc., RF™ Silicon Tuner for Global Hybrid TV

    1-187. Fresco Microchip Inc., Low Power Single-Chip Hybrid Receiver

    1-188. Fujitsu Microelectronics Limited, Two new System-on-Chip

    1-189. Fujitsu Microelectronics Limited, Graphics SoC for in-vehicle video, audio applications

    1-190. Fujitsu Microelectronics America, Inc., Integrated Flexible WiMAX SoC

    1-191. Fujitsu Microelectronics America, Inc., RFCMOS devices용 SoC

    1-192. Fujitsu Semiconductor America, Inc., NanGate Design Optimizer™ and Library Creator™

    1-193. Fujitsu Semiconductor America, Inc., New graphics SoC for next-generation high-end

    1-194. Fujitsu Semiconductor America, Inc., Breakthrough 3D imaging technology

    1-195. GateRocket, Inc, Verification and debug solutions for advanced FPGAs

    1-196. Genesis Microchip Inc., Breakthrough Faroudja Quality Video Processing

    1-197. Global Unichip Corp., Revolutionary Solid State Drive Controller

    1-198. Global Unichip Corp., Achieves Gigahertz+ Frequency on ARM Cortex-A9

    1-199. Global Unichip Corp., Hardened Versions of Diamond Standard Series Processors

    1-200. GoldenRAM Inc., UpgradeDetect software

    1-201. IBM, Blue Gene/Q project - an 18 core homogeneous SoC for exascale simulation

    1-202. IBM, Linux-based software for ARM's architecture

    1-203. IBM, Viability of 3-D Chip Stacking Technique

    1-204. IBM, World's Fastest On-Chip Dynamic Memory Technology

    1-205. IBM, 90-nanometer (nm) Chips for mobile telecommunications technologies

    1-206. IBM, Breakthrough "Energy-Smart" Business Computing Systems

    1-207. IMEC, IPKISS as open source software platform

    1-208. New Paths to scaling advanced gatestack and channel material for next-generation CMOS

    1-209. IMEC, ultra-low power electrocardiogram (ECG) chip and a Bluetooth Low Energy (BLE) radio

    1-210. IMEC, Exploration Flows for 3D ICs

    1-211. IMEC, Cutting-Edge CMOS Processes

    1-212. ImmenStar, Inc., MuLan(TM) EPON Switch Chipset

    1-213. Impinj, Inc., Item-Level RFID with Monza? 5 Tag Chip and STP™ Source Tagging Platform

    1-214. Impinj, Inc., Multiple-time Programmable AEON(R)/MTP Memory

    1-215. Inbrics, Proprietary mobile TV chipset and SoC (System On Chip) technology

    1-216. Security Chip for Europe’s Biggest Contactless Bank Card Project

    1-217. Infineon Technologies AG, Chips on New 300-Millimete

    1-218. Infineon Technologies AG, Security Chips for NFC-Enabled Smart Phones

    1-219. Infineon Technologies AG, 3.0 Gb/s Advanced Hard Disk Drive Read Channel

    1-220. Infineon Technologies AG, First Dual-Band RF-CMOS Transceiver Core

    1-221. Innovation Quest Inc., SOC solutions for high resolution phase/frequency detection

    1-222. InPA Systems, Inc., Active Debug(TM) for Rapid Prototyping

    1-223. Insprit, u-blox GPS for advanced multimedia e-reader tablet

    1-224. Insprit, Converged media and high-speed mobile broadband

    1-225. Intel Technology, system-on-chip (SoC) smartphones

    1-226. Intel Technology, new communications systems SoC,

    1-227. Intel Technology, Haswell SoC Design

    1-228. Intel Technology, Atom(TM) processor CE4100

    1-229. Intel Corporation, First IA System on Chip for Consumer Electronics

    1-230. Intelligent Automation Corp, Revolutionary Advancement in Diagnostic Technology, SuperHUMS

    1-231. Intematix Corp., ChromaLit Technology

    1-232. Intematix Corp., Amber-color LED

    1-233. Intematix Corp., LED-based Solid State Lighting (SSL)

    1-234. InterSense Inc., Next-Generation "NavChip" IMU

    1-235. InterSense Inc., NavChip(TM)-Breakthrough IMU Chip for Navigation

    1-236. IPextreme Inc., Xena™ IP management system

    1-237. IPextreme Inc., IEEE 1149.7 cJTAG IP Solution

    1-238. Xena™; Complete platform for Semiconductor IP Operations Comes to the Cloud

    1-239. Jasper Design Automation, JasperGold? formal technology for verification and design flows

    1-240. First of Its Kind System-Level Verification IP for ARM ACE-based SoCs

    1-241. Jasper Design Automation, Portfolio of Innovative Formal Technology Patents

    1-242. Jazz Semiconductor, Inc., RF models and design kits

    1-243. Jazz Semiconductor, Inc. BCD05/BCD25 Process

    1-244. Kilopass Technology Inc., Non-Volatile Memory IP

    1-245. Kilopass Technology Inc., XPM™ Non Volatile Memory IP

    1-246. Kilopass Technology Inc., Largest Embedded Logic Non-Volatile Memory

    1-247. Kimotion, Breakthrough Technology for Modeling, Verification and Optimization

    1-248. Knobias, Inc., Monolithic System Technology

    1-249. Laird Technologies, Inc., new CMS69273 LTE ceiling mount broadband omnidirectional antenna

    1-250. Laird Technologies, Inc., Digi-Key’s Product Training Modules (PTM)

    1-251. Industry’s Highest Integration ADSL2/2+ System-on-Chip for Broadb and Home Gateways

    1-252. Industry First VDSL2 Vectoring Chip Enabling Full System-Level Crosstalk Noise

    1-253. Lantiq, GPON (Gigabit Passive Optical Network) System-on-Chip (SoC)

    1-254. Lattice Semiconductor, New 32 QFN Package For MachXO2 Programmable Logic Devices

    1-255. Lattice Semiconductor, Intelligent HD Video Analytics For The HDR-60

    1-256. Lattice Semiconductor, SERCOS III REAL-TIME INDUSTRIAL ETHERNET SOLUTION

    1-257. Liga Systems, Inc, NitroSIM(TM) v1.0 Delivering 10X Acceleration

    1-258. Liga Systems, Inc, Breakthrough Hybrid Simulator

    1-259. Lightspeed Logic, LTA90, a Standard Cell Based Reconfigurable Logic IP

    1-260. Lilliputian Systems(TM), Inc., Fuel Cell on a Chip(TM) Technology

    1-261. LocoLabs, Palm-Sized Development Platform for Connected Embedded Products

    1-262. LogicVision, Inc., boundary scan solution to support the IEEE 1149.6

    1-263. LSI Corporation, Industry's First 28nm System-on-a-Chip

    1-264. LSI Corporation, Next-Generation High-Capacity Hard Disk Drives

    1-265. LSI Corporation, MegaRAID(R) technology

    1-266. LTX-Credence Corporation, Next Generation Testing Platform

    1-267. LTX-Credence Corporation, Diamond Test Systems

    1-268. Luxtera, dedicated silicon photonics process at its 300-mm

    1-269. Luxtera, new foundry service for Optoelectronic Systems Integration in Silicon (OpSIS)

    1-270. Luxtera, Next-Generation Optical Interconnects

    1-271. Lyrtech Inc., Small Form Factor (SFF) Software Defined Radio (SDR) Development Platform

    1-272. Magma Design Automation Inc., Integrated IC Implementation System

    1-273. Magma Design Automation Inc., FineSim(TM) SPICE

    1-274. Marvell, New For-In-One ZigBee Microcontroller SoC

    1-275. Marvell, Avastar 88W8797 Wireless SoC and 8800 LED Lighting Controller

    1-276. Marvell, 3D Blu-ray playback integrated in the ARMADA(TM) 1000

    1-277. Marvell, World's First WLAN Plus Bluetooth Single Chip Solution

    1-278. Next Generation Veloce2 Emulation Platform with VirtuaLAB Capabilities

    1-279. Mentor Graphics Corporation, Questa? functional verification platform

    1-280. Mentor Graphics Corporation, Olympus-SoC(TM) Product for Multi-Corner, Multi-Mode Design

    1-281. Mentor Graphics Corporation, Breakthrough in Verification Intelligence

    1-282. Mentor Graphics Corporation, ADiT Fast-SPICE Technology

    1-283. Micronas, 0.18 micrometer high-voltage CMOS process

    1-284. Micronas, APB 71x6/8I ATSC / QAM-256 and DVB-T hybrid PC-TV PCIe processors

    1-285. MicroProbe, Inc., ADVANCED NON-MEMORY PROBE CARDS

    1-286. MicroProbe, Inc, Mx-FinePitch (Mx-FP) Product

    1-287. Microstaq SEV™-disruptive product based on the company's unique VentilumTMchip

    1-288. Microtune, Inc., DTV Chipset

    1-289. Microtune, Inc., Unique ClearTune Technology

    1-290. MediaTek Inc., LED TV IC Solutions

    1-291. Mindray DS USA, New Premium M7 Portable Ultrasound System

    1-292. Mindspeed Technologies, Inc., the world's first long-term evolution (LTE) femtocell

    1-293. Mindspeed Technologies, Inc., New 3G + LTE Dual-Mode SoCs

    1-294. Mindspeed Technologies, Inc., System-on-Chip (SoC) Processors Drive New Capabilities

    1-295. Mindspeed Technologies, Inc., Transcede(TM) baseband device for 3G/4G/long-term evolution

    1-296. MIPS Technologies, Inc., System-on-Chip (SoC) Processors

    1-297. MIPS Technologies, Inc., Semiconductor Unveil Chipset for $100 Android 4.0 Tablet

    1-298. MIPS Technologies, Inc., First 40nm USB PHY IP core and First USB-certified 1.8v 45nm

    1-299. MIPS Technologies, Inc., HDMI-based Solution for Digital Home

    1-300. MIPS Technologies, Inc., MIPS32(R) 4KEc(R) Core for Use in Breakthrough Stream Processor

    1-301. Micrel Inc., 4/5-port Layer-2 Switch-on-a-Chip ICs

    1-302. Micrel Inc., High Side Load Switches

    1-303. Mistletoe Technologies, Inc., Security System-on-a-Chip (SoC) featuring VPN

    1-304. MOSAID Technologies Inc., Single Channel, Full Performance 16-Die NAND Flash Stack

    1-305. MoSys, Inc., Bandwidth Engine IC Interoperability with LSI SerDes

    1-306. Serial chip-to-chip communications solutions for next generation networking systems

    1-307. MoSys, Inc., 1T-SRAM Technology for use in the Semiconductor Manufacturer's

    1-308. MoSys, Inc., E-DiskmaxIO(TM) SSDs

    1-309. 1T-SRAM(R) Technology for Its Leading-Edge 65nm Semiconductor Manufacturing Proces

    1-310. mPhase Technologies, First Stage of Planned Triple-Axis Prototype Magnetometer

    1-311. MTI MicroFuel Cells Inc., Global Testing of Mobion? Power Solutions

    1-312. NEC Electronics, Virtual PC-Class Thin Client System

    1-313. NeoMagic Corporation, MagicVaultTM, its USB 3.0 based UFD USB

    1-314. NeoMagic Corporation, Dynamic Random-Access-Memory

    1-315. Nethra Imaging, Inc., Ultra-Low-Power High Definition 1080p60

    1-316. NewTek, New Stereoscopic Features and Interactive Production Workflow

    1-317. NEXX Systems, Inc., 3D packaging tool technology

    1-318. NEXX Systems, Inc., High Density 3D through-silicon-vias (TSVs).

    1-319. Novas Software, Inc., Siloti(TM) Visibility Enhancement (VE) software

    1-320. Novelics, portfolio with coolSRAM-6T embedded memory IP and MemQuest compiler

    1-321. Novelics, MemQuestTM, a Suite of Memory Compilers Built on a Common Platform

    1-322. Numonyx B.V., Phase Change Memory Technology

    1-323. NXP, World's Smallest Logic Package With the Largest Pads

    1-324. NXP, 3D for NXP Set-Top Box platform

    1-325. NXP, GPS/GSM-based Toll System

    1-326. Oasys Design Systems, New Chip Synthesis(TM) Platform

    1-327. Oasys Design Systems, Synthesizes 100-Million-Gate Chips

    1-328. Objective Interface Systems, Inc., ORBexpress communications middleware framework

    1-329. Objective Interface Systems, Inc., ORBexpress(R) Communications Middleware

    1-330. Integrated Switching Buck Regulators with Industry Leading Conversion Ratios

    1-331. ON Semiconductor, BelaSigna R261 High Performance Voice Capture System-on-Chip

    1-332. ON Semiconductor, XPressArray-II (XPA-II)

    1-333. Panasonic Corporation, smart TVs with 1.4GHz Cortex-A9 SoC

    1-334. Panasonic Corporation, ARM for a smart TV system-on-chip

    1-335. Panasonic Corporation, Leading-Edge SoC Process Technologies

    1-336. Phase One A/S, Sensor+ CCD Technology

    1-337. Pixelworks, Inc., Network-On-Chip (NoC) Interconnect Fabric IP

    1-338. Pixelworks, Inc., New Generation of ImageProcessor ICs Products

    1-339. Planar Systems, Inc., Clarity RP and RX Rear-projection Displays

    1-340. PositiveID Corporation, GlucoChip Membrane

    1-341. PositiveID Corporation, Glucose-sensing RFID Microchip

    1-342. Powervation, digital power IC solutions

    1-343. QPC Lasers, Inc., High-brightness, High-power Semiconductor Chip-based Lasers

    1-344. Qualcomm Atheros Inc., Embedded Video-over-Wi-Fi Solution

    1-345. Qualcomm Atheros Inc., AR9390 is a single-chip, dual-band 11n 3x3

    1-346. Qualcomm Atheros Inc., World’s First Complete 10G EPON SoC Solution

    1-347. Qualcomm Atheros Inc., World's Most Integrated Single-Chip 802.11g Access Point Solution

    1-348. Rambus Inc., CryptoFirewall™ Technology Builds Momentum for Advanced Video Security

    1-349. Rambus Inc., advanced differential signaling for SoC-to-memory interfaces

    1-350. Rambus Inc., Mobile XDR(TM) Memory for Next-Generation Mobile Products

    1-351. Real Intent Software, Advanced Sign-Off Verification Capabilities

    1-352. Real Intent Software, Verification Software With World-Class Debug Software

    1-353. Real Intent, Inc., Meridian CDC(TM) Software

    1-354. RedMere, Ultra-thin Portable Micro-HDMI

    1-355. Redpine Signals, Inc., Industry's First Simultaneous Dual-band 2.4GHz 802.11n/BT4.0

    1-356. Low-Power 802.11n Wi-Fi? I/O Connectivity for PSoC? 3 and PSoC 5 Platforms

    1-357. Redpine Signals, Inc., Lite-NMAX(TM) ultra low power 802.11n Wi-Fi(R)

    1-358. RedShift Systems, Thermal Light ValveTM(TLV) Technology

    1-359. Renesas Electronics Corporation, High-Performance and Compact SoC

    1-360. Renesas Electronics Corporation, Cat-4 150Mbps LTE Downlink Throughput

    1-361. Renesas Electronics Corporation, First Integrated LTE Triple-Mode Platform

    1-362. Renesas Electronics Corporation, Next Generation SoCs

    1-363. Renesas Technology Corp., 200MHz SuperH Chip for Powertrain Systems

    1-364. RF Digital, World's First Wi-Fi(R) Module

    1-365. RFaxis, Advanced Wireless Three-in-One Solution

    1-366. RFaxis, Four Fundamental Patents for Its Disruptive Single-Chip

    1-367. RFaxis, RF Front-end Integrated Circuits

    1-368. Samsung Electronics, Co., Ltd, High-K Metal Gate Logic Process and Design Ecosystem

    1-369. Sandbridge Technologies, SB3000(R) series SOC platform

    1-370. Corporation, Breakthrough, System-on-a-Chip (SoC) for Next-Generation Embedded Systems

    1-371. Sarnoff Corporation, High Performance, Low Energy Consumption SoC

    1-372. Scintera Networks, Inc., Integrated Dual-RMS RF Power Measurement Unit

    1-373. Scintera Networks, Inc., 50k units of its RF PA predistortion linearizer SoC

    1-374. Adaptive RF Power Amplifier Linearizer (RFPAL) system-on-chip (SoC)

    1-375. Sensor System Solutions, Inc., Acquired Social Networks Development Company

    1-376. Sensor System Solutions, Inc., Sensor Signal Conditioner

    1-377. Sequans Communications, Second generation LTE semiconductor technology

    1-378. Sequans Communications, next-generation FDD and TDD LTE chips and global LTE platforms

    1-379. Sequans Communications, WiMAXsystem-on-chip Technology

    1-380. Sequence Design, Inc., SMMART (Sequence Macro Modeling using Advanced Region Technique)

    1-381. Shrink Nanotechnologies, Inc., ShrinkChip Rapid Prototyping System (RPS)

    1-382. Sidense Corp., Logic Non-Volatile Memory (LNVM) one-time programmable(OTP) memory IP cores

    1-383. Sidense Corp., Embedded Non-Volatile Memory (NVM) Products

    1-384. SiEnergy Systems, LLC, Breakthrough Solid Oxide Fuel Cell (SOFC)

    1-385. Sigma Designs, Connected media platforms

    1-386. Sigma Designs, MIMO 기술을 사용한 혁신적 new ClearPath 기술

    1-387. Sigma Designs, Inc., SMP8656 Secure Media Processor(TM)

    1-388. Sigma Designs, Inc., VXP image-processing technology

    1-389. Sigma Designs, Z-Wave Solutions for Home Entertainment Networking

    1-390. Sigma Designs, Inc., Revolutionary Powerline Communications Technology With MIMO

    1-391. Sigma Designs, Advanced Video and Networking Technologies

    1-392. analog and mixed-signal IC products to complement Freescale's multimedia portfolio

    1-393. SigmaTel Inc., System-on-chip Controllers

    1-394. Silicon & Software Systems Ltd. (S3), Software Modem System-on-Chip Design

    1-395. Silicon & Software Systems Ltd. (S3), Baseband ADC and Power Management Solutio
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