2013년 디지털 컨버전스(융합) 글로벌 혁신기술 종합분석 세트: 시스템온칩(SoC) 700트랜드
도서명:2013년 디지털 컨버전스(융합) 글로벌 혁신기술 종합분석 세트: 시스템온칩(SoC) 700트랜드
저자/출판사:편집부/비아이알
쪽수:4000쪽
출판일:2012-12-01
ISBN:9788966670758
목차
제 1장 2013년 디지털 컨버전스(융합) 글로벌 혁신기술 700 트랜드
1. 2013년 디지털 컨버전스(융합) 글로벌 혁신기술 700 트랜드
1-1. 3Plus1 Technology, First-Generation Programmable Multicore CoolEngines
1-2. Abilis Systems, OFDM Demodulator
1-3. Abilis Systems, OFDM Demodulator
1-4. Actions Semiconductor Co., mixed-signal system-on-a-chip (SoC) and multimedia digital signal processi ng (DSP) solutions for portable consu mer electronics
1-5. Actions Semiconductor Co., New G1000 Product Family
1-6. Actions Semiconductor Co., New generation of video technology - Advanced Media Video-AMV3.0.
1-7. Advantest Corporation, Intel's Preferred Quality Supplier Award
1-8. Advantest Corporation, T2000 Test System
1-9. Advantest Corporation, T2000 SoC Test Platform
1-10. Advantest Corporation, New Low-Cost Consumer Device SoC Test Solution
1-11. Advantest Corporation, T2000 open-architecture SoC Test System
1-12. AeroComm Inc., proprietary or standard communications protocols including antennas, complete RF pro cessing hardware
1-13. AeroComm Inc., ZB2430 "ZigBee Your Way(TM)" Transceiver
1-14. Agilent Technologies Inc., 글로벌 네비게이션 위성 시스템(GNSS)소프트웨어 Signal Studio
1-15. Agilent Technologies Inc., Connectivity Software for Electronic Test Instruments
1-16. Agilent Technologies Inc., Latest Genesys Software Enhances RF System Design
1-17. Agilent Technologies Inc., Signal Processing Libraries for 802.11ac WLAN and 60-GHz 802.11ad
1-18. Agilent Technologies Inc., Percello's Aquilo Femtocell System-on-a-Chip (SoC)
1-19. Agilent Technologies Inc., GoldenGate software for Advanced RFIC Development
1-20. AltaSens, Inc., JVC KENWOOD Acquires AltaSens, Inc.
1-21. AltaSens, Inc., Berkeley Design Automation Analog FastSPICE™ Platform for HD CMOS Image Sensors
1-22. AltaSens, Inc., WDR CMOS imaging solution
1-23. AltaSens, Inc., BitsDReam(TM) Technology
1-24. Altior, New AltraFlex™ Compression Decompression File System(CeDeFS) Accelerator Solution
1-25. Altior, Software Development Kit for Hardware-Accelerated Data Compression for Web Servers, Network and Storage Applications
1-26. Ambarella Inc., S2 IP Camera SoC Delivers 4K Ultra HD Resolution
1-27. Ambarella Inc., Wireless Camera Developer’s Kit
1-28. Ambarella Inc., Next Generation of Digital Still Cameras with 1080p60 Fluid Motion Video
1-29. Ambarella Inc., A7 IP Camera SoC
1-30. Ambarella Inc., iOne Camera Applications Processor Enables a New Class of Android™-Based Smart Cameras
1-31. Ambarella Inc., A1 digital camera platform
1-32. Ambarella Inc., A7 system-on-chip (SoC) for high-resolution video and image quality in consumer HD cameras
1-33. AMI Semiconductor, Platform Solutions for Next Generation Computing Products
1-34. Apache Design Solutions, power and noise solutions for Chip-Package-System (CPS) convergence
1-35. Apache Design Solutions, Platform solutions for Chip-Package-System convergence
1-36. Applied Micro Circuit, CMOS transmitter ICs for Dense Wavelength Division Multiplexing line-side applic ations
1-37. Applied Micro Circuit, PacketPro™ APM8669x Processors
1-38. Applied Materials, Inc., New Innovations for Cutting-Edge Chip Designs
1-39. Applied Micro Circuits Corporation, world's first embedded processing SoC
1-40. Applied Micro Circuits Corporation, Next-generation PacketPro(TM) Multicore Processor System-on-a-C hip (SoC) Family
1-41. Applied Micro Circuits Corporation, Dual-core Titan, Software Compatible with AMCC's PowerPC(TM) 4 40 family
1-42. Aptina, AR1011HS digital camera image sensor
1-43. Aptina, AR0130CS image sensor
1-44. Aptina, CMOS image sensor solutions; new ASX340AT system-on-chip(SOC)
1-45. Aptina, Native 1080p System on Chip Solution for High Definition Video Imaging Applications
1-46. Aptina, SOC Imaging Solution for 720P/30fps HD Video
1-47. Aptina, Automotive-Grade Imaging SOC
1-48. Aptina, A-Pix Technology
1-49. Aptina Imaging, 5-Megapixel SoC
1-50. Arada Systems, 802.11p Telematics System With First DSRC SD Card Operating at 5.9GHz
1-51. Arada Systems, WLAN-Based RFID Solution
1-52. ARC International Announces Virtual Bass™ Audio Enrichment Solution
1-53. ARC International plc, Configurable processors and multimedia subsystems
1-54. ARC International, Dynamic Adaptive Encoding
1-55. ArchPro, Next-Generation Multi-Voltage Verification Solution
1-56. Arkados, convergent digital home networking
1-57. Arkados, HomePlug AV System-on-Chip
1-58. Arkados, Direct-to-Speaker(tm) Internet Radio Reference Design
1-59. Arkados, System-on-Chip Powers Digital Audio
1-60. ARM, New High-Performance System IP
1-61. ARM, Forbes’ Top 10 ‘World's Most Innovative Companies’
1-62. ARM, Second Generation of MALI-T600 Graphics Processors
1-63. ARM, GPU Computing Trend, Improving Systems Performance and Energy-Efficiency
1-64. ARM, ARM? Processor Optimization Pack™ (POP) solutions for TSMC 40nm and 28nm process
1-65. ARM, ARM Cortex™-A9 MPCore™ Processors and Mali™-400 MP GPUs
1-66. ARM, Next-Generation Security For Services Running On Connected Devices
1-67. ARM, Mali(TM) graphics processor architecture
1-68. ARM, Ultra Low-Power Physical IP Technology
1-69. ARM, Mali(TM)-200 and Mali-55 cores
1-70. Aristos Logic, Multi-Protocol RAID Storage Processor Device
1-71. Arteris, Inc., network-on-chip(NoC) interconnect IP solutions; FlexLLI MIPI Low Latency Interface(LLI) IP
1-72. Arteris, Inc., Interconnect Models to SoC Designers
1-73. Arteris, Inc., MIPI Alliance Low Latency Interface (LLI) 1.0 interchip communication specification
1-74. Arteris Inc., Chip to Chip Link
1-75. Arteris SA, Network-on-Chip (NoC)
1-76. Arteris, SystemC Transaction Level Models(TLM)
1-77. AsicAhead NV, AA1001 Worldwide WiMAX Radio
1-78. AsicAhead NV, Breakthrough Single-Chip Programmable Radio
1-79. Aviza Technology, Inc., Next-generationatomic layer deposition(ALD) system
1-80. Avnera, TiE50 Awards
1-81. Avnera, Rocketboost™ Wireless Zone 2 Audio Technology
1-82. Avnera Corporation, Analog System-on-Chip (ASoC) technology for consumer electronics devices
1-83. Avnera Corporation, Multipoint HD Wireless Audio Platform
1-84. Avnera Corporation, Flagship AudioMagic Chips
1-85. Avnera Corporation, "Wired-Quality" Wireless Music and Voice Chip Technology
1-86. AXCESS International Inc., Dual-active RFID technology
1-87. Axxcelera Broadband Wireless, Sequans System on Chip (SoC)
1-88. BIOIDENT Technologies Inc., First Complete Lab-on-a-Chip System Based on Printed Semiconductor T echnology
1-89. Bluespec, Inc., Bluespec high-level synthesis toolset for development of system-on-a chip (SoC) desi gns
1-90. Bluespec, Inc., Bluespec high-level synthesis toolset
1-91. Broadcom, OpenTV 5 technology
1-92. Broadcom, 5G WiFi Combo Chip for Smartphones and Tablets
1-93. Broadcom, 5G WiFi Chip Family Wins R&D 100 Award
1-94. Broadcom, 5G WiFi with Integrated SoCs for Home and SMB Networks
1-95. Broadcom, HomePlug AV Technology Powers New devolo 'Duo' Adapter
1-96. Broadcom, Industry's First Set-Top Box Platform for Secure Convergence of Pay-TV and Open Internet Applications
1-97. Broadcom Corporation, lndustry's first 40nm dual-core hybrid gateway system-on-a-chip (SoC)
1-98. Broadcom, New Platforms Optimized for Android 'Ice Cream Sandwich' Smartphones
1-99. Broadcom, Combo Chips from Broadcom Accelerate Transition to Dual
-Band Wi-Fi for Mainstream Smartphones and Tablets
1-100. Broadcom, 5G WiFi Leadership with New 802.11ac Chips for Enterprise and Wireless Cloud Networks
1-101. Broadcom, full range of platform solutions for Hybrid TV and Over-the-Top (OTT) Media Players
1-102. Broadcom, Industry's first MoCA 2.0-Integrated Portfolio
1-103. Broadcom Corporation, Six system-on-a-chip (SoC) MoCA 2.0 products
1-104. Broadcom Corporation, Industry’s First SoC to Achieve 1.25Gbps for 4G/LTE Microwave Backhaul
1-105. BroadLight, BroadLights BL2000 ONT System on Chip (SoC)
1-106. Cadence, Innovative Verification Debugger
1-107. Cadence Design Systems, Inc., Advanced-Node Digital Technology
1-108. Cadence Design Systems, Inc., New Interface Verification IP for Development of Cloud Infrastructure
1-109. Cadence Design Systems, Inc., design intellectual property (IP) for the LPDDR3 mobile memory stand ard
1-110. Cadence, High-Performance, Giga-scale, 20nm Design
1-111. Cadence Design Systems, Inc., Breakthrough 32nm HD Digital Camera SoC for Ambarella
1-112. Cadence Design Systems, Inc., New Cadence Allegro Technology
1-113. Cadence Design Systems, Inc., Cortex-A15 processor-based SoCs
1-114. Calypto Design Systems, Electronic System-Level (ESL) hardware design and power optimization
1-115. Calypto Design Systems, Automated Tool for Memory Power Optimization
1-116. Carbon Design, ESL(Electronic System Level)
1-117. Carbon Design, Simplify SoC Optimization
1-118. Carbon Design Systems, Accurate Arteris FlexNoC Interconnect Models for Carbon SoCDesigner Plus
1-119. Carbon Design Systems, Advanced Microcontroller Bus Architecture(AMBA(R)) Advanced eXtensible Int erface (AXI) specification Analysis Package for SoC Designer Plus
1-120. Carbon Design Systems, High-performance virtual system prototyping solution
1-121. Cavium, Flexible CNW6611L Media SoC
1-122. Cavium, 프로젝트 Thunder
1-123. Cavium, OCTEON Fusion™ platform
1-124. Cavium, OCTEON Fusion™ platform selected for large scale commercial LTE
1-125. Cavium, Market-Leading Solutions for LTE Mobile
1-126. Cavium, Breakthrough Processor Solutions for the Secure Cloud and Enterprise
1-127. Cavium, Industry's Most Powerful “Base Station-on-a-chip” Family
1-128. Cavium, World’s First Adapter with 1 Million SSL Transactions per Second for Virtualized Data Center and Cloud Computing
1-129. Cavium, OCTEON? Fusion “Base Station-on-a-Chip” Platform
1-130. Cavium, First SoC with Breakthrough Search Processing and Over 100Gbps Single-chip Application P erformance for Enterprise
1-131. Cavium, next-generation version of its ARM11-based Econa SoCs
1-132. Cavium, Next Generation OCTEON(TM) II Multi-Core MIPS64(R) Internet Application Processor
1-133. CebaTech, Advanced network and storage embedded systems solutions
1-134. CebaTech Inc, Breakthrough ESL technology
1-135. Celeno, High Performance Video-Grade Technology
1-136. Celeno Communications, Semiconductors for multimedia Wi-Fi home networking
1-137. Celeno, Video-Grade 3x3 PCIe Wi-Fi Chip
1-138. Celeno Communications, Wireless Set-Top Box Platforms
1-139. Celeno Communications, video-grade Wi-Fi chipset
1-140. Celeno Communications, WiFi System on a Chip
1-141. Centillium, HDplay™ transceiver for a new High Definition (HD) projector
1-142. Centillium, HDmobile™, The World’s First Unified USB?, HDMI?, and DisplayPort™ Solution for Mobil e Devices
1-143. Centillium, Next-Generation Communications ICs
1-144. Centillium Communications, Inc., eXtremeVDSL2 System-on-a-Chip Solution
1-145. Centillium Communications, Inc., Entropia VoIP Solution
1-146. Chipcon AS, ZigBee(TM) Compliant System-on-Chip Solutions
1-147. Chipcon AS, CC1110 System-on-Chip (SoC) solution
1-148. Chipidea, Next-Generation USB IP
1-149. chipwrights, 고 해상도, 네트워크 연결된 카메라 카메라 칩에 CW5631 시스템
1-150. chipwrights, 2M 픽셀 카메라 레퍼런스 디자인
1-151. chipwrights, 360 Degree Camera Reference Design
1-152. chipwrights, CW5631 SoC Selected as Video DSP in Video Surveillance Camera
1-153. chipwrights, 새로운 리눅스 소프트웨어 개발 킷
1-154. Christie, Brilliant3D(TM) technology
1-155. ClariPhy Communications Inc., LightSpeed, industry’s first single-chip 40G coherent SoC
1-156. Cobra Digital, Cobra PET Portable Media Player
1-157. Commex Technologies Ltd., Vulcan family of NICs - the Vulcan SPHT6210
1-158. conexant, High-Performance Speech Recognition in Embedded Applications
1-159. conexant, 고성능 디지털 오디오 프로세서 CX20805
1-160. Conexant, Audio, Embedded Modem and Fax
1-161. Conexant, New High-Performance Digital Audio Processor with Integrated Power Management
1-162. Conexant, New Low-Power, High-Definition Audio Codecs for Mobile
1-163. Conexant Systems, Inc., Digital signage-oriented system-on-chip(SoC) with Linux and Android develo pment support
1-164. Conexant Systems, Inc., New System-on-Chip (SoC) Controller
1-165. Conexant Systems, Inc., Passive Optical Networks를 통해 차세대 Triple-Play Services를 가능하게 하는 혁신적 Controllers
1-166. Coresonic AB, Breakthrough DSP architecture for wireless baseband
1-167. Coresonic AB, Multimode Wireless Modems
1-168. Coronis Systems, new Wavenis-enabled industrial gateway
1-169. Coronis Systems, Next Generation Ultra-Low-Power, Long Range Wavenis System-on-Chip Solution
1-170. CoWare, Comprehensive ESL Design Environment
1-171. Creative Technology Ltd, ZMS StemCell media processor and customised Android software
1-172. Crocus Technology, 멀티스케일의 소프트웨어 및 고급 방법론 Crocus and Kintech Sign Agreement to P erform Nanotechnology R&D in Russia
1-173. Crocus Technology, High-Temperature MLU Application Technology
1-174. Crocus Technology, System-On-Chip Solutions Based on Magnetic-Logc-Unit™ (MLU) Technolog
1-175. Crocus Technology, Smart Cards Based on Magnetic-Logic-Unit™ (MLU) Technology
1-176. Crocus Technology, Thermally Assisted Switching (TAS)-based MRAM Technology
1-177. CPU Technology, Inc., Embedded Operating System
1-178. CPU Technology, Inc., SuperQ X3(TM)
1-179. CSEM, IcyTRX, an ultra-low power 2.4GHz transceiver platform
1-180. CSEM, Innovative tele-healthcare solutions
1-181. CSR plc, Smart TV Remote Control Based on CSR ?Energy ? Platform
1-182. CSR plc, SiRFatlasVI™ Automotive Infotainment Platform
1-183. CSR plc, First SiRFstarV™ Chip Optimised for Mobile Devices
1-184.CSR plc, RoadTunes™ ADK 3.0
1-185. CSR plc, Most Highly Integrated Processors for Printers
1-186. CSR plc, DirectOffice™ Mobile Print 3.0
1-187. CSR plc, SiRFatlasV™ Multifunction SoC Platform
1-188. CSR plc, Auto-qualified SoC Product, Breakthrough Connected Infotainment Solution
1-189. CSR, leading edge 40nm low power RF CMOS technology IP
1-190. Cypress Semiconductor Corp., Low-Power 2.4-GHz WirelessUSB™-NL Solution for its U and W Wirel ess Presenter Series
1-191. Cypress Semiconductor Corp., PSoC Creator™ Integrated Design Environment For PSoC? 3 and PSo C 5 Architectures
1-192. Cypress Semiconductor Corp., PSoC? Platform
1-193. Cypress Semiconductor Corp., TrueTouch? Single-Layer Sensor Solution Drives Touchscreen
1-194. Cypress Semiconductor Corp., Revolutionary PSoC Creator™ Design Environment for the PSoC? 3 an d PSoC 5 programmable system-on-chip families
1-195. Cypress Semiconductor Corp., New PSoC? Solution for Digital Filters
1-196. Cypress Semiconductor Corp., EZ-Color(TM) HBLED Controller Family
1-197. Cypress Semiconductor Corp., High-performance, Mixed-signal, Programmable solutions
1-198. Cypress Semiconductor Corp., PSoC(R) Mixed-Signal Array
1-199. D2 Technologies, Embedded IP communications software platforms
1-200. D2 Technologies, Solutions for VoIP and IP Communications over WiMAX for Mobile Devices Based o n the Android(TM) and Linux
1-201. DAFCA Incorporated, Leading Edge SoC Verification Solutions
1-202. Datacard Group, SIM Card Personalization System
1-203. DecaWave, ultra wideband (UWB) technology for Real Time Location Systems (RTLS)
1-204. DecaWave, Real Time Location Systems (RTLS)
1-205. Denali Software, Inc., EDA360의 실행을 가속화 하고, 효율적이고 가격 경쟁력 있는 시스템 부품 모델링 및 IP 통합 제공
1-206. Denali Software, Inc., DDR SDRAM Controller IP and PHY Solution
1-207. Denali Software, Inc., LPDDR2 SDRAM Controller IP For High-Performance, Low-Power SoC
1-208. Denali Software, Inc., MMAV 2008 Verification IP
1-209. Denali Software, Inc., PureSpec(TM) Verification Software
1-210 DesignArt Networks, DAN3000 Base Station SoC Family
1-211. DesignArt Networks, System-on-Chip Platforms
1-212. Dialog Semiconductor Plc, VoIP IC family to address high end phones
1-213. Dialog Semiconductor Plc, VOIP technology adopted by VTech for S-series desktop phones
1-214. DiBcom, Octopus2s, the digital TV & radio chip for Automotive Head Units
1-215. DiBcom, Octopus 2: the first component capable of demodulating fixed and mobile digital television
1-216. Dialog Semiconductor Plc, DA6011 power management IC
1-217. Digi International, Enhanced iDigi Device Cloud
1-218. Digi International, Real World M2M Solutions
1-219. Digi International, Smart Energy Device Platform for German 'E-DeMa' Smart Grid Pilot
1-220. Digi International, New Class of Cloud-Connected Wireless M2M Solutions Based on Intel Architecture
1-221. Digi International, Digi Best of Show at Embedded World 2012 for Android Application Development K it with iDigi Device Cloud
1-222. Digi International, Europe's First Multi-Channel Wireless Module
1-223. Digi International, Industry's First Embedded Application Development Kit for Android
1-224. Digi International, Industry's First Cloud-Connected Microcontrollers with Out-of-Box Cloud Connectivity
1-225. Digi International, Internet of ANYthing™ to Iridium Satellite Network
1-226. Digi International, Next Generation ZigBee Smart Energy Gateway
1-227. Digi International, Industry's First Sprint Certified 3G System-on-Module
1-228. Digi International, Wireless Network Infrastructure for AddEnergie's Electric Vehicle Charging Stations
1-229. Digi International, iDigi Device Cloud, Wireless Gateways and ZigBee Modules
1-230. Digi International, First Embedded Module to Enable FIPS 140-2 Security for Wireless Devices
1-231. Digium, Inc., award-winning Unified Communications (UC) system
1-232. Digium, Inc., Advanced Asterisk Based VoIP Gateways
1-233. Digium, Inc., Switchvox-Unified-Communications-Solution
1-234. Digium, Inc., VoiceBus(TM) Technology
1-235. DivX, Inc., World’s First DivX Plus? HD System-on-Chip
1-236. DivX, Inc., World's First DivX HD Certified Android Moile Phone
1-237. DivX, Inc., World's First DivX Certified Blu-ray Chip
1-238. DSP Group, Inc., Home Automation Service Platform
1-239. DSP Group, Inc., Revolutionary DBM11 Noise-Elimination SOC for Mobile Devices
1-240. DSP Group, Inc., Wireless chipset solutions for converged communications at home and office
1-241. DSP Group, Inc., VoIP Chipset Powers Gigaset DECT IP Multicell System
1-242. DSP Group, Inc., DECT Chipset Family; DCX81 Revolutionary Advanced SoC
1-243. DSP Group, Inc., XpandR platform
1-244. Dust Networks, low power wireless sensor network (WSN) technology
1-245. Dynamic Card Solutions, CardWizard? Software
1-246. Dynamic Card Solutions, CardWizard software
1-247. ECS EliteGroup, Mobile WiMAX/EDGE Device
1-248. Emulex Corporation, Fast I/O Caching and Connectivity SAN Solutions
1-249. Emulex Corporation, In-Box 16G Fibre Channel Solution for VMwarevSphere? 5.1
1-250. Emulex Corporation, intelligent I/O management application
1-251. Emulex Corporation, 10GBASE-T Connectivity for its OneConnect™ UCNAs
1-252. Emulex Corporation, InSpeed SOC 422
1-253. ENSPERT, Mobile TV Reception Chip, Android Tablet Player and Mobile TV Router Solution
1-254. EnCentrus Systems Inc., Next generation OpenCable(TM) products
1-255. Enea, Realtime and Linux Implementations in Next Generation Networking Infrastructure
1-256. Enea, Optima Tools to Support Heterogeneous Multicore and Linux
1-257. Enea, OSE Real-Time OS
1-258. ESI, New esiFIT Module for Advanced Microfabrication
1-259. ESI, Thin-Film-on-Silicon (TFOS) Laser Trimming Systems
1-260. eSilicon Corporation, TSMC Value Chain Aggregator (VCA) 프로그램
1-261. eSilicon Corporation, Broad-Based Access to 28nm-90nm SerDes Cores
1-262. eSilicon Corporation, High-Performance Network Chips
1-263. eSilicon Corporation, eFlex™ content-addressable memory (CAM) cores and eFlexCAM™ compilers
1-264. Faraday Technology, Strengthen IP Alliance for Advanced Nodes
1-265. Faraday Technology Corporation, ASIC Design Service for ARM? Cortex™ -A9 Processors and Mali™ -400 MP GPUs
1-266. Faraday Technology Corporation, Strengthen IP Alliance for Advanced Nodes
1-267. Faraday Technology Corporation, Low Power Mobile Platform
1-268. Firetide, Inc., Public Safety Wireless Video Surveillance Network
1-269. Firetide, Inc., FWC 1000 and FWC 2000, Two New Wireless LAN(WLAN) Controllers
1-270. Firetide, Inc., New MIMO Technology
1-271. FormFactor, Inc., Advanced Probe Card
1-272. nc., SmartMatrix™ 100XP™ probe solution
1-273. ctor, Inc., New MEMS probing contact technology
1-274. Fortinet, FortiWifi(TM)-60C - new multi-threat security appliances
1-275. Freescale Semiconductor, Xtrinsic Touch-Sensing Software Portfolio for Next-Generation Human-Mach ine Interfaces
1-276. Freescale Semiconductor, Reference Solutions for Automotive HVAC Control
1-277. Freescale Semiconductor, First Generation of QorIQ Qonverge Base Station-on-Chip Portfolio with Ne w Metrocell Product
1-278. Freescale Semiconductor, Industry’s First Single-Chip Automotive Instrument Cluster Solution to S12 M agniV Portfolio
1-279. Freescale Semiconductor, QorIQ Qonverge Small Cell SoC Technology
1-280. Freescale Semiconductor, Kinetis 32-bit microcontroller portfolio
1-281. Freescale Semiconductor, Industry’s first system-on-chip two-way
radio enabling cost effective digital radios
1-282. Freescale Semiconductor, Breakthrough MSC7120 SoC
1-283. Fresco Microchip Inc., RF™ Silicon Tuner for Global Hybrid TV
1-284. Fresco Microchip Inc., Low Power Single-Chip Hybrid Receiver
1-285. Fujitsu, World's First On-chip CMOS Power Detector
1-286. Fujitsu, Ultra High-Speed Short-Reach Data Transmission Based on Multi-level Signalling and Advanc ed ADC/DAC Technology
1-287. Fujitsu, Next-Generation Multimode, Multiband Transceiver IC for 2G/3G/4G Mobile Products
1-288. Fujitsu Microelectronics Limited, Two new System-on-Chip (SoC) solutions for FSK-based Powerline Communication (PLC)
1-289. Fujitsu Microelectronics Limited, Graphics SoC for in-vehicle video, audio applications
1-290. Fujitsu Semiconductor America, Inc., NanGate Design Optimizer™ and Library Creator™ for Advanced 28nm SoC Design
1-291. Fujitsu Semiconductor America, Inc., New graphics SoC for next-generation high-end automotive grap hics applications
1-292. Fujitsu Semiconductor America, Inc., Breakthrough 3D imaging technology
1-293. GateRocket, Inc, Verification and debug solutions for advanced FPGAs
1-294. GCT Semiconductor, Inc., LTE Single-Chip ; Powers Coolpad Quattro 4G Smartphone for MetroPCS
1-295. GCT Semiconductor, Inc., LTE Single-Chip Now Certified for LTE Modules on Verizon Wireless Network
1-296. GCT Semiconductor, Inc., Chipset for New Sierra Wireless 4G LTE Tri-fi Hotspot
1-297. GCT Semiconductor, Inc., New Reference Solution for Mobile 4G VoLTE
1-298. GCT Semiconductor, Inc., World's First WiMAX+HSPA 4G Smartphone
1-299. GCT Semiconductor, Inc., New WiMAX 2 (802.16m) 4G Single-chip With 4X4 MIMO System
1-300. Genesis Microchip Inc., Breakthrough Faroudja Quality Video Processing
1-301. GLOBALFOUNDRIES, FinFET Transistor Architecture Optimized for Next-Generation Mobile Devices
1-302. GLOBALFOUNDRIES, Next-Generation Devices on 20nm and FinFET Process Technologies
1-303. GLOBALFOUNDRIES, GPS SoC Using GLOBALFOUNDRIES 65nm-LPe RF Process Technology
1-304. GLOBALFOUNDRIES, BCDlite™ Technology Process for Applications in the Automotive Industry
1-305. Global Unichip Corp., Industry-Leading IP Portal Grows Ecosystem
1-306. Global Unichip Corp., Synopsys의 DesignWare IP와 GUC의 ASIC desig service을 조합
1-307. Global Unichip Corp., Revolutionary Solid State Drive Controller
1-308. Global Unichip Corp., Achieves Gigahertz+ Frequency on ARM Cortex-A9 Processor with Synopsys IC Compiler
1-309. Global Unichip Corp., Hardened Versions of Diamond Standard Series Processors
1-310. GoldenRAM Inc., UpgradeDetect software
1-311. IBM, PureSystems Family to Help Clients Tame Big Data
1-312. IBM, leading developer of high-performance flash memory solutions
1-313. IBM, Blue Gene/Q project - an 18 core homogeneous SoC for exascale simulation
1-314. IBM, Linux-based software for ARM's architecture
1-315. IBM, Viability of 3-D Chip Stacking Technique
1-316. IBM, World's Fastest On-Chip Dynamic Memory Technology
1-317. IBM, 90-nanometer (nm) Chips for mobile telecommunications technologies
1-318. IBM, Breakthrough "Energy-Smart" Business Computing Systems
1-319. Imec, single-chip ethylene sensor to monitor fruit ripening
1-320. IMEC, low-power multi-standard transceiver for sensor networks
1-321. IMEC, IPKISS as open source software platform
1-322. IMEC, New Paths to scaling advanced gatestack and channel material for next-generation CMOS
1-323. IMEC, ultra-low power electrocardiogram (ECG) chip and a Bluetooth Low Energy (BLE) radio
1-324. IMEC, Exploration Flows for 3D ICs
1-325. IMEC, Cutting-Edge CMOS Processes
1-326. ImmenStar, Inc., MuLan(TM) EPON Switch Chipset
1-327. Impinj, Inc., Item-Level RFID with Monza? 5 Tag Chip and STP™ Source Tagging Platform
1-328. Impinj, Inc., Multiple-time Programmable AEON(R)/MTP Memory
1-329. Inbrics, Proprietary mobile TV chipset and SoC (System On Chip) technology
1-330. Infineon Technologies, Innovative LED Drivers(TLD73xxEK SoC 드라이버)
1-331. Infineon Technologies, Single-Chip 24GHz Radar Solutions for Industrial and Commercial Sensor Syste ms
1-332. Infineon Technologies AG, Security Chip for Europe’s Biggest Contactless Bank Card Project
1-333. Infineon Technologies AG, Chips on New 300-Millimeter Thin Wafer Technology for Power Semicondu ctors
1-334. Infineon Technologies AG, Security Chips for NFC-Enabled Smart Phones
1-335. Infineon Technologies AG, 3.0 Gb/s Advanced Hard Disk Drive Read Channel and 6 Gb/s Serdes Int erface
1-336. Infineon Technologies AG, First Dual-Band RF-CMOS Transceiver Core
1-337. Innovation Quest Inc., SOC solutions for high resolution phase/frequency detection
1-338. InPA Systems, Inc., Active Debug(TM) for Rapid Prototyping
1-339. Insprit, u-blox GPS for advanced multimedia e-reader tablet
1-340. Insprit, Converged media and high-speed mobile broadband
1-341. Intel, Intel to Acquire Infineon’s Wireless Solutions Business
1-342. Intel, Atom™ Processor-Based Storage Platform
1-343. Intel, 10 Investments at Intel Capital Global Summit
1-344. Intel Technology, system-on-chip (SoC) smartphones
1-345. Intel Technology, new communications systems SoC,
1-346. Intel Technology, Haswell SoC Design
1-347. Intel Technology, Atom(TM) processor CE4100
1-348. Intel Corporation, First IA System on Chip for Consumer Electronics
1-349. Intelligent Automation Corp, Revolutionary Advancement in Diagnostic Technology, SuperHUMS
1-350. Intematix Corp., ChromaLit Technology
1-351. Intematix Corp., Amber-color LED
1-352. Intematix Corp., LED-based Solid State Lighting (SSL)
1-353. InterSense Incorporated, MEMS 기반 하이브리드 모션 인식 시스템
1-354. InterSense Inc., Next-Generation "NavChip" IMU
1-355. InterSense Inc., NavChip(TM)-Breakthrough IMU Chip for Navigation
1-356. IPextreme Inc.
1-357. IPextreme Inc., Xena™ IP management system
1-358. IPextreme Inc., IEEE 1149.7 cJTAG IP Solution
1-359. IPextreme Inc., Xena™; Complete platform for Semiconductor IP Operations Comes to the Cloud
1-360. Jasper Design Automation, JasperGold? formal technology for verification and design flows
1-361. Jasper Design Automation, First of Its Kind System-Level Verification IP for ARM ACE-based SoC
1-362. Jasper Design Automation, Portfolio of Innovative Formal Technology Patents
1-363. Jazz Semiconductor, Inc., RF models and design kits
1-364. Jazz Semiconductor, Inc. BCD05/BCD25 Process
1-365. Kilopass Technology Inc., Non-Volatile Memory IP
1-366. Kilopass Technology Inc., XPM™ Non Volatile Memory IP
1-367. Kilopass Technology Inc., Largest Embedded Logic Non-Volatile Memory
1-368. Kimotion, Breakthrough Technology for Modeling, Verification and Optimization of Analog and Mixed-S ignal ICs and SoCs
1-369. Knobias, Inc., Monolithic System Technology
1-370. Laird Technologies, Inc., new CMS69273 LTE ceiling mount broadband omnidirectional antenna
1-371. Laird Technologies, Inc., Digi-Key’s Product Training Modules(PTM)
1-372. Lantiq, Reverse Powered Fiber to the Distribution Point (FTTdp) Solution
1-373. Lantiq, Industry Leading Solution for Voice Telephony in Broadband Gateways
1-374. Lantiq, Industry’s Highest Integration ADSL2/2+ System-on-Chip for Broadband Home Gateways
1-375. Lantiq, Industry First VDSL2 Vectoring Chip Enabling Full System-Level Crosstalk Noise Cancellation
1-376. Lantiq, GPON(Gigabit Passive Optical Network) System-on-Chip(SoC)
1-377. Lattice Semiconductor, Serial Image Sensor Bridge Support For Sony IMX136/104
1-378. Lattice Semiconductor, New 32 QFN Package For MachXO2 Programmable Logic Devices
1-379. Lattice Semiconductor, Intelligent HD Video Analytics For The HDR-60 Camera Development Kit At IS C West
1-380. Lattice Semiconductor, SERCOS III REAL-TIME INDUSTRIAL ETHERNET SOLUTION
1-381. Liga Systems, Inc, NitroSIM(TM) v1.0 Delivering 10X Acceleration
1-382. Liga Systems, Inc, Breakthrough Hybrid Simulator
1-383. Lightspeed Logic, LTA90, a Standard Cell Based Reconfigurable Logic IP
1-384. Lilliputian Systems(TM), Inc., Fuel Cell on a Chip(TM) Technology
1-385. LocoLabs, Palm-Sized Development Platform for Connected Embedded Products
1-386. LogicVision, Inc., boundary scan solution to support the IEEE 1149.6 standard for high-speed interco nnects
1-387. LSI Corporation, Open source hardware to muscle into data centers
1-388. LSI Corporation, LSI의 Axxia 통신 프로세서
1-389. LSI Corporation, Industry's First 28nm System-on-a-Chip to Accelerate Delivery of Higher-Capacity H ard Disk Drives
1-390. LSI Corporation, Next-Generation High-Capacity Hard Disk Drives
1-391. LSI Corporation, MegaRAID(R) technology
1-392. LTX-Credence Corporation, Next Generation Testing Platform for Application Specific Standard Produc ts(ASSP)
1-393. LTX-Credence Corporation, Diamond Test Systems
1-394. Luxtera, dedicated silicon photonics process at its 300-mm research and pilot production wafer fab I n Crolles
1-395. Luxtera, new foundry service for Optoelectronic Systems Integrationin Silicon(OpSIS)
1-396. Luxtera, Next-Generation Optical Interconnects
1-397. Lyrtech Inc., Small Form Factor (SFF) Software Defined Radio (SDR) Development Platform
1-398. Marvell, PCIe-base DragonFly Platform for Servers and Storage Systems
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