2012년 디지털 컨버전스(융합) 글로벌 혁신기술 종합분석 > 공학일반

2012년 디지털 컨버전스(융합) 글로벌 혁신기술 종합분석



도서명:2012년 디지털 컨버전스(융합) 글로벌 혁신기술 종합분석
저자/출판사:BIR,Research,Group/비아이알
쪽수:3000쪽
출판일:2012-06-01
ISBN:9788966670420

목차
제 1장 2012년 디지털 컨버전스(융합) 글로벌 혁신기술 종합분석

1. 2012년 디지털 컨버전스(융합) 글로벌 혁신기술 종합분석

1-1. 3Plus1 Technology, First-Generation Programmable Multicore CoolEngines

1-2. Abilis Systems, OFDM Demodulator

1-3. Abilis Systems, OFDM Demodulator

1-4. mixed-signal system-on-a-chip and multimedia digital signal processing

1-5. Actions Semiconductor Co

1-6. New generation of video technology - Advanced Media Video-AMV3.0

1-7. Advantest Corporation

1-8. Advantest Corporation, T2000 Test System

1-9. Advantest Corporation, T2000 SoC Test Platform

1-10. Advantest Corporation, New Low-Cost Consumer Device SoC Test Solution

1-11. Advantest, T2000 open-architecture SoC Test System

1-12. proprietary or standard communications protocols including antennas, complete RF

1-13. AeroComm Inc., ZB2430 "ZigBee Your Way(TM)" Transceiver

1-14. Agilent Technologies Inc., Latest Genesys Software Enhances RF System Design

1-15. Signal Processing Libraries for 802.11ac WLAN and 60-GHz 802.11ad

1-16. Agilent Technologies Inc., Percello's Aquilo Femtocell System-on-a-Chip(SoC)

1-17. Agilent Technologies Inc., GoldenGate software for Advanced RFIC Development

1-18. Berkeley Design Automation Analog FastSPICE™ Platform for HD CMOS Image Sensors

1-19. AltaSens, Inc., WDR CMOS imaging solution

1-20. AltaSens, Inc., BitsDReam(TM) Technology

1-21. Altior, New AltraFlex™ Compression Decompression File System (CeDeFS) Accelerator Solution

1-22. Altior, Software Development Kit for Hardware-Accelerated Data Compression for Web Servers

1-23. Ambarella Inc., Next Generation of Digital Still Cameras with 1080p60 Fluid Motion Video

1-24. Ambarella Inc., A7 IP Camera SoC

1-25. Ambarella Inc., iOne Camera Applications Processor Enables a New Class of Android™

1-26. Ambarella Inc., A1 digital camera platform

1-27. A7 system-on-chip (SoC) for high-resolution video and image quality in consumer HD cameras

1-28. AMI Semiconductor, Platform Solutions for Next Generation Computing Products

1-29. power and noise solutions for Chip-Package-System (CPS) convergence

1-30. Apache Design Solutions, Platform solutions for Chip-Package-System convergence

1-31. Applied Materials, Inc., New Innovations for Cutting-Edge Chip Designs

1-32. Applied Micro Circuits Corporation, world's first embedded processing SoC

1-33. Next-generation PacketPro(TM) Multicore Processor System-on-a-Chip (SoC) Family

1-34. Dual-core Titan, Software Compatible with AMCC's PowerPC(TM) 440 family

1-35. Aptina, CMOS image sensor solutions; new ASX340AT system-on-chip (SOC)

1-36. Aptina, Native 1080p System on Chip Solution for High Definition Video Imaging Applications

1-37. Aptina, SOC Imaging Solution for 720P/30fps HD Video

1-38. Aptina, Automotive-Grade Imaging SOC

1-39. Aptina, A-Pix Technology

1-40. Aptina Imaging, 5-Megapixel SoC

1-41. Arada Systems, 802.11p Telematics System With First DSRC SD Card Operating at 5.9GHz

1-42. Arada Systems, WLAN-Based RFID Solution

1-43. ARC International plc, Virtual Bass™ Audio Enrichment Solution

1-44. ARC International plc, Configurable processors and multimedia subsystems

1-45. ARC International, Dynamic Adaptive Encoding

1-46. ArchPro, Next-Generation Multi-Voltage Verification Solution

1-47. Arkados, convergent digital home networking

1-48. Arkados, HomePlug AV System-on-Chip

1-49. Arkados, Direct-to-Speaker(tm) Internet Radio Reference Design

1-50. Arkados, System-on-Chip Powers Digital Audio

1-51. ARM, ARM? Processor Optimization Pack™ (POP) solutions for TSMC 40nm and 28nm process

1-52. ARM, ARM Cortex™-A9 MPCore™ Processors and Mali™-400 MP GPUs

1-53. ARM, Next-Generation Security For Services Running On Connected Devices

1-54. ARM, Mali(TM) graphics processor architecture

1-55. ARM, Ultra Low-Power Physical IP Technology

1-56. ARM, Mali(TM)-200 and Mali-55 cores

1-57. Aristos Logic, Multi-Protocol RAID Storage Processor Device

1-58. network-on-chip(NoC) interconnect IP solutions; FlexLLI MIPI Low Latency Interface(LLI) IP

1-59. MIPI Alliance Low Latency Interface (LLI) 1.0 interchip communication specification

1-60. Arteris SA, Network-on-Chip (NoC)

1-61. Arteris, SystemC Transaction Level Models (TLM)

1-62. AsicAhead NV, AA1001 Worldwide WiMAX Radio

1-63. AsicAhead NV, Breakthrough Single-Chip Programmable Radio

1-64. Atheros Communications, Inc., End-to-End 10G EPON Platform

1-65. Align Technology Leveraging 802.11n 1-Stream Specification; 802.11nmedia access control

1-66. Atheros Communications, Inc., Wireless System-on-a-chip(WiSoC)

1-67. Aviza Technology, Inc., Next-generationatomic layer deposition (ALD) system

1-68. Avnera Corporation, Analog System-on-Chip (ASoC) technology for consumer electronics

1-69. Avnera Corporation, Multipoint HD Wireless Audio Platform

1-70. Avnera Corporation, Flagship AudioMagic Chips

1-71. Avnera Corporation, "Wired-Quality" Wireless Music and Voice Chip Technology

1-72. AXCESS International Inc., Dual-active RFID technology

1-73. Axxcelera Broadband Wireless, Sequans System on Chip (SoC)

1-74. First Complete Lab-on-a-Chip System Based on Printed Semiconductor Technology

1-75. Bluespec high-level synthesis toolset for development of system-on-a chip (SoC) designs

1-76. Bluespec, Inc., Bluespec high-level synthesis toolset

1-77. Broadcom Corporation, lndustry's first 40nm dual-core hybrid gateway system-on-a-chip (SoC)

1-78. Broadcom Corporation, Six system-on-a-chip (SoC) MoCA 2.0 products

1-79. Industry’s First SoC to Achieve 1.25Gbps for 4G/LTE Microwave Backhaul

1-80. Broadcom Corporation, Satellite set-top box (STB) system-on-a-chip (SoC) solution

1-81. Broadcom Corporation, Breakthrough '3G Phone-on-a-Chip' Processor

1-82. Processor technology with Realtek’s rich-featured Ethernet switching technology

1-83. BroadLight, BroadLights BL2000 ONT System on Chip (SoC)

1-84. Cadence Design Systems, Inc., Advanced-Node Digital Technology

1-85. New Interface Verification IP for Development of Cloud Infrastructure

1-86. design intellectual property(IP) for the LPDDR3 mobile memory standard

1-87. Cadence Design Systems, Inc., Breakthrough 32nm HD Digital Camera SoC for Ambarella

1-88. Cadence Design Systems, Inc., New Cadence Allegro Technology

1-89. Cadence Design Systems, Inc., Cortex-A15 processor-based SoCs

1-90. Electronic System-Level (ESL) hardware design and power optimization

1-91. Calypto Design Systems, Automated Tool for Memory Power Optimization

1-92. Accurate Arteris FlexNoC Interconnect Models for Carbon SoCDesigner Plus

1-93. Carbon Design Systems, Advanced Microcontroller Bus Architecture Advanced eXtensible

1-94. Carbon Design Systems, High-performance virtual system prototyping solution

1-95. Cavium, Inc., First SoC with Breakthrough Search Processing and Over 100G bps Single-chip

1-96. Cavium, Inc., next-generation version of its ARM11-based Econa SoCs

1-97. Next Generation OCTEON(TM) II Multi-Core MIPS64(R) Internet Application Processor

1-98. CebaTech, Advanced network and storage embedded systems solutions

1-99. CebaTech Inc, Breakthrough ESL technology

1-100. Celeno Communications, Semiconductors for multimedia Wi-Fi home networking

1-101. Celeno Communications, Wireless Set-Top Box Platforms

1-102. Celeno Communications, video-grade Wi-Fi chipset

1-103. Celeno Communications, WiFi System on a Chip

1-104. Centillium Communications, Inc., eXtremeVDSL2 System-on-a-Chip Solution

1-105. Centillium Communications, Inc., Entropia VoIP Solution

1-106. Chipcon AS, ZigBee(TM) Compliant System-on-Chip Solutions

1-107. Chipcon AS, CC1110 System-on-Chip (SoC) solution

1-108. Chipidea, Next-Generation USB IP

1-109. Christie, Brilliant3D(TM) technology

1-110. ClariPhy Communications Inc., LightSpeed, industry’s first single-chip 40G coherent SoC

1-111. Cobra Digital, Cobra PET Portable Media Player

1-112. Commex Technologies Ltd., Vulcan family of NICs - the Vulcan SP HT6210

1-113. Digital signage-oriented system-on-chip (SoC) with Linux and Android development support

1-114. Conexant Systems, Inc., New System-on-Chip (SoC) Controller

1-115. 통해 차세대 Triple-Play Services를 가능하게 하는 혁신적 Controllers

1-116. Coresonic AB, Breakthrough DSP architecture for wireless baseband

1-117. Coresonic AB, Multimode Wireless Modems

1-118. Coronis Systems

1-119. Next Generation Ultra-Low-Power, Long Range Wavenis System-on-Chip Solution

1-120. CoWare, Comprehensive ESL Design Environment

1-121. Crocus Technology, System-On-Chip Solutions Based on Magnetic-Logic-Unit™ (MLU) Technolog

1-122. Crocus Technology, Smart Cards Based on Magnetic-Logic-Unit™ (MLU) Technology

1-123. Crocus Technology, Thermally Assisted Switching (TAS)-based MRAM Technology

1-124. CPU Technology, Inc., Embedded Operating System

1-125. CPU Technology, Inc., SuperQ X3(TM)

1-126. CSR plc, Most Highly Integrated Processors for Printers

1-127. CSR plc, DirectOffice™ Mobile Print 3.0

1-128. CSR plc, SiRFatlasV™ Multifunction SoC Platform

1-129. CSR plc, Auto-qualified SoC Product, Breakthrough Connected Infotainment Solution

1-130. CSR, leading edge 40nm low power RF CMOS technology IP

1-131. Cypress Semiconductor Corp., TrueTouch? Single-Layer Sensor Solution Drives Touchscreen

1-132. Revolutionary PSoC Creator™ Design Environment for the PSoC? 3 and PSoC 5 programmable

1-133. Cypress Semiconductor Corp., New PSoC? Solution for Digital Filters

1-134. Cypress Semiconductor Corp., EZ-Color(TM) HBLED Controller Family

1-135. Cypress Semiconductor Corp., High-performance, Mixed-signal, Programmable solutions

1-136. Cypress Semiconductor Corp., PSoC(R) Mixed-Signal Array

1-137. D2 Technologies, Embedded IP communications software platforms

1-138. D2 Technologies, Solutions for VoIP and IP Communications over WiMAX

1-139. DAFCA Incorporated, Leading Edge SoC Verification Solutions

1-140. Datacard Group, SIM Card Personalization System

1-141. DecaWave, ultra wideband (UWB) technology for Real Time Location Systems (RTLS)

1-142. DecaWave, Real Time Location Systems(RTLS)

1-143. Denali Software, Inc., DDR SDRAM Controller IP and PHY Solution

1-144. Denali Software, Inc., LPDDR2 SDRAM Controller IP For High-Performance, Low-Power SoC

1-145. Denali Software, Inc., MMAV 2008 Verification IP

1-146. Denali Software, Inc., PureSpec(TM) Verification Software

1-147. Dialog Semiconductor Plc, VoIP IC family to address high end phones

1-148. Dialog Semiconductor Plc, VOIP technology adopted by VTech for S-series desktop phones

1-149. Dialog Semiconductor Plc, DA6011 power management IC

1-150. Digium, Inc., award-winning Unified Communications (UC) system

1-151. Digium, Inc., Advanced Asterisk Based VoIP Gateways

1-152. Digium, Inc., Switchvox-Unified-Communications-Solution

1-153. Digium, Inc., VoiceBus(TM) Technology

1-154. DivX, Inc., World’s First DivX Plus? HD System-on-Chip

1-155. DivX, Inc., World's First DivX Certified Blu-ray Chip

1-156. Wireless chipset solutions for converged communications at home and office

1-157. DSP Group, Inc., VoIP Chipset Powers Gigaset DECT IP Multicell System

1-158. DSP Group, Inc., DECT Chipset Family; DCX81 Revolutionary Advanced SoC

1-159. DSP Group, Inc., XpandR platform

1-160. Dynamic Card Solutions, CardWizard? Software

1-161. Dynamic Card Solutions, CardWizard software

1-162. ECS EliteGroup, Mobile WiMAX/EDGE Device

1-163. Emulex Corporation, intelligent I/O management application

1-164. Emulex Corporation, 10GBASE-T Connectivity for its OneConnect™ UCNAs

1-165. Emulex Corporation, InSpeed SOC 422

1-166. ENSPERT, Mobile TV Reception Chip, Android Tablet Player and Mobile TV Router Solution

1-167. EnCentrus Systems Inc., Next generation OpenCable(TM) products

1-168. Enea, Realtime and Linux Implementations in Next Generation Networking Infrastructure

1-169. Enea, Optima Tools to Support Heterogeneous Multicore and Linux

1-170. Enea, OSE Real-Time OS

1-171. ESI, New esiFIT Module for Advanced Microfabrication

1-172. ESI, Thin-Film-on-Silicon (TFOS) Laser Trimming Systems

1-173. eSilicon Corporation, High-Performance Network Chips

1-174. eFlex™ content-addressable memory (CAM) cores and eFlexCAM™ compilers

1-175. Faraday Technology Corporation, ASIC Design Service for ARM? Cortex™-A9 Processors

1-176. Faraday Technology Corporation, Strengthen IP Alliance for Advanced Nodes

1-177. Faraday Technology Corporation, Low Power Mobile Platform

1-178. Firetide, Inc., FWC 1000 and FWC 2000, Two New Wireless LAN (WLAN) Controllers

1-179. Firetide, Inc., New MIMO Technology

1-180. FormFactor, Inc., SmartMatrix™ 100XP™ probe solution

1-181. FormFactor, Inc., New MEMS probing contact technology

1-182. Fortinet, FortiWifi(TM)-60C - new multi-threat security appliances

1-183. Freescale Semiconductor, Kinetis 32-bit microcontroller portfolio

1-184. Industry’s first system-on-chip two-way radio enabling cost effective

1-185. Freescale Semiconductor, Breakthrough MSC7120 SoC

1-186. Fresco Microchip Inc., RF™ Silicon Tuner for Global Hybrid TV

1-187. Fresco Microchip Inc., Low Power Single-Chip Hybrid Receiver

1-188. Fujitsu Microelectronics Limited, Two new System-on-Chip

1-189. Fujitsu Microelectronics Limited, Graphics SoC for in-vehicle video, audio applications

1-190. Fujitsu Microelectronics America, Inc., Integrated Flexible WiMAX SoC

1-191. Fujitsu Microelectronics America, Inc., RFCMOS devices용 SoC

1-192. Fujitsu Semiconductor America, Inc., NanGate Design Optimizer™ and Library Creator™

1-193. Fujitsu Semiconductor America, Inc., New graphics SoC for next-generation high-end

1-194. Fujitsu Semiconductor America, Inc., Breakthrough 3D imaging technology

1-195. GateRocket, Inc, Verification and debug solutions for advanced FPGAs

1-196. Genesis Microchip Inc., Breakthrough Faroudja Quality Video Processing

1-197. Global Unichip Corp., Revolutionary Solid State Drive Controller

1-198. Global Unichip Corp., Achieves Gigahertz+ Frequency on ARM Cortex-A9

1-199. Global Unichip Corp., Hardened Versions of Diamond Standard Series Processors

1-200. GoldenRAM Inc., UpgradeDetect software

1-201. IBM, Blue Gene/Q project - an 18 core homogeneous SoC for exascale simulation

1-202. IBM, Linux-based software for ARM's architecture

1-203. IBM, Viability of 3-D Chip Stacking Technique

1-204. IBM, World's Fastest On-Chip Dynamic Memory Technology

1-205. IBM, 90-nanometer (nm) Chips for mobile telecommunications technologies

1-206. IBM, Breakthrough "Energy-Smart" Business Computing Systems

1-207. IMEC, IPKISS as open source software platform

1-208. New Paths to scaling advanced gatestack and channel material for next-generation CMOS

1-209. IMEC, ultra-low power electrocardiogram (ECG) chip and a Bluetooth Low Energy (BLE) radio

1-210. IMEC, Exploration Flows for 3D ICs

1-211. IMEC, Cutting-Edge CMOS Processes

1-212. ImmenStar, Inc., MuLan(TM) EPON Switch Chipset

1-213. Impinj, Inc., Item-Level RFID with Monza? 5 Tag Chip and STP™ Source Tagging Platform

1-214. Impinj, Inc., Multiple-time Programmable AEON(R)/MTP Memory

1-215. Inbrics, Proprietary mobile TV chipset and SoC (System On Chip) technology

1-216. Security Chip for Europe’s Biggest Contactless Bank Card Project

1-217. Infineon Technologies AG, Chips on New 300-Millimete

1-218. Infineon Technologies AG, Security Chips for NFC-Enabled Smart Phones

1-219. Infineon Technologies AG, 3.0 Gb/s Advanced Hard Disk Drive Read Channel

1-220. Infineon Technologies AG, First Dual-Band RF-CMOS Transceiver Core

1-221. Innovation Quest Inc., SOC solutions for high resolution phase/frequency detection

1-222. InPA Systems, Inc., Active Debug(TM) for Rapid Prototyping

1-223. Insprit, u-blox GPS for advanced multimedia e-reader tablet

1-224. Insprit, Converged media and high-speed mobile broadband

1-225. Intel Technology, system-on-chip (SoC) smartphones

1-226. Intel Technology, new communications systems SoC,

1-227. Intel Technology, Haswell SoC Design

1-228. Intel Technology, Atom(TM) processor CE4100

1-229. Intel Corporation, First IA System on Chip for Consumer Electronics

1-230. Intelligent Automation Corp, Revolutionary Advancement in Diagnostic Technology, SuperHUMS

1-231. Intematix Corp., ChromaLit Technology

1-232. Intematix Corp., Amber-color LED

1-233. Intematix Corp., LED-based Solid State Lighting (SSL)

1-234. InterSense Inc., Next-Generation "NavChip" IMU

1-235. InterSense Inc., NavChip(TM)-Breakthrough IMU Chip for Navigation

1-236. IPextreme Inc., Xena™ IP management system

1-237. IPextreme Inc., IEEE 1149.7 cJTAG IP Solution

1-238. Xena™; Complete platform for Semiconductor IP Operations Comes to the Cloud

1-239. Jasper Design Automation, JasperGold? formal technology for verification and design flows

1-240. First of Its Kind System-Level Verification IP for ARM ACE-based SoCs

1-241. Jasper Design Automation, Portfolio of Innovative Formal Technology Patents

1-242. Jazz Semiconductor, Inc., RF models and design kits

1-243. Jazz Semiconductor, Inc. BCD05/BCD25 Process

1-244. Kilopass Technology Inc., Non-Volatile Memory IP

1-245. Kilopass Technology Inc., XPM™ Non Volatile Memory IP

1-246. Kilopass Technology Inc., Largest Embedded Logic Non-Volatile Memory

1-247. Kimotion, Breakthrough Technology for Modeling, Verification and Optimization

1-248. Knobias, Inc., Monolithic System Technology

1-249. Laird Technologies, Inc., new CMS69273 LTE ceiling mount broadband omnidirectional antenna

1-250. Laird Technologies, Inc., Digi-Key’s Product Training Modules (PTM)

1-251. Industry’s Highest Integration ADSL2/2+ System-on-Chip for Broadb and Home Gateways

1-252. Industry First VDSL2 Vectoring Chip Enabling Full System-Level Crosstalk Noise

1-253. Lantiq, GPON (Gigabit Passive Optical Network) System-on-Chip (SoC)

1-254. Lattice Semiconductor, New 32 QFN Package For MachXO2 Programmable Logic Devices

1-255. Lattice Semiconductor, Intelligent HD Video Analytics For The HDR-60

1-256. Lattice Semiconductor, SERCOS III REAL-TIME INDUSTRIAL ETHERNET SOLUTION

1-257. Liga Systems, Inc, NitroSIM(TM) v1.0 Delivering 10X Acceleration

1-258. Liga Systems, Inc, Breakthrough Hybrid Simulator

1-259. Lightspeed Logic, LTA90, a Standard Cell Based Reconfigurable Logic IP

1-260. Lilliputian Systems(TM), Inc., Fuel Cell on a Chip(TM) Technology

1-261. LocoLabs, Palm-Sized Development Platform for Connected Embedded Products

1-262. LogicVision, Inc., boundary scan solution to support the IEEE 1149.6

1-263. LSI Corporation, Industry's First 28nm System-on-a-Chip

1-264. LSI Corporation, Next-Generation High-Capacity Hard Disk Drives

1-265. LSI Corporation, MegaRAID(R) technology

1-266. LTX-Credence Corporation, Next Generation Testing Platform

1-267. LTX-Credence Corporation, Diamond Test Systems

1-268. Luxtera, dedicated silicon photonics process at its 300-mm

1-269. Luxtera, new foundry service for Optoelectronic Systems Integration in Silicon (OpSIS)

1-270. Luxtera, Next-Generation Optical Interconnects

1-271. Lyrtech Inc., Small Form Factor (SFF) Software Defined Radio (SDR) Development Platform

1-272. Magma Design Automation Inc., Integrated IC Implementation System

1-273. Magma Design Automation Inc., FineSim(TM) SPICE

1-274. Marvell, New For-In-One ZigBee Microcontroller SoC

1-275. Marvell, Avastar 88W8797 Wireless SoC and 8800 LED Lighting Controller

1-276. Marvell, 3D Blu-ray playback integrated in the ARMADA(TM) 1000

1-277. Marvell, World's First WLAN Plus Bluetooth Single Chip Solution

1-278. Next Generation Veloce2 Emulation Platform with VirtuaLAB Capabilities

1-279. Mentor Graphics Corporation, Questa? functional verification platform

1-280. Mentor Graphics Corporation, Olympus-SoC(TM) Product for Multi-Corner, Multi-Mode Design

1-281. Mentor Graphics Corporation, Breakthrough in Verification Intelligence

1-282. Mentor Graphics Corporation, ADiT Fast-SPICE Technology

1-283. Micronas, 0.18 micrometer high-voltage CMOS process

1-284. Micronas, APB 71x6/8I ATSC / QAM-256 and DVB-T hybrid PC-TV PCIe processors

1-285. MicroProbe, Inc., ADVANCED NON-MEMORY PROBE CARDS

1-286. MicroProbe, Inc, Mx-FinePitch (Mx-FP) Product

1-287. Microstaq SEV™-disruptive product based on the company's unique VentilumTMchip

1-288. Microtune, Inc., DTV Chipset

1-289. Microtune, Inc., Unique ClearTune Technology

1-290. MediaTek Inc., LED TV IC Solutions

1-291. Mindray DS USA, New Premium M7 Portable Ultrasound System

1-292. Mindspeed Technologies, Inc., the world's first long-term evolution (LTE) femtocell

1-293. Mindspeed Technologies, Inc., New 3G + LTE Dual-Mode SoCs

1-294. Mindspeed Technologies, Inc., System-on-Chip (SoC) Processors Drive New Capabilities

1-295. Mindspeed Technologies, Inc., Transcede(TM) baseband device for 3G/4G/long-term evolution

1-296. MIPS Technologies, Inc., System-on-Chip (SoC) Processors

1-297. MIPS Technologies, Inc., Semiconductor Unveil Chipset for $100 Android 4.0 Tablet

1-298. MIPS Technologies, Inc., First 40nm USB PHY IP core and First USB-certified 1.8v 45nm

1-299. MIPS Technologies, Inc., HDMI-based Solution for Digital Home

1-300. MIPS Technologies, Inc., MIPS32(R) 4KEc(R) Core for Use in Breakthrough Stream Processor

1-301. Micrel Inc., 4/5-port Layer-2 Switch-on-a-Chip ICs

1-302. Micrel Inc., High Side Load Switches

1-303. Mistletoe Technologies, Inc., Security System-on-a-Chip (SoC) featuring VPN

1-304. MOSAID Technologies Inc., Single Channel, Full Performance 16-Die NAND Flash Stack

1-305. MoSys, Inc., Bandwidth Engine IC Interoperability with LSI SerDes

1-306. Serial chip-to-chip communications solutions for next generation networking systems

1-307. MoSys, Inc., 1T-SRAM Technology for use in the Semiconductor Manufacturer's

1-308. MoSys, Inc., E-DiskmaxIO(TM) SSDs

1-309. 1T-SRAM(R) Technology for Its Leading-Edge 65nm Semiconductor Manufacturing Proces

1-310. mPhase Technologies, First Stage of Planned Triple-Axis Prototype Magnetometer

1-311. MTI MicroFuel Cells Inc., Global Testing of Mobion? Power Solutions

1-312. NEC Electronics, Virtual PC-Class Thin Client System

1-313. NeoMagic Corporation, MagicVaultTM, its USB 3.0 based UFD USB

1-314. NeoMagic Corporation, Dynamic Random-Access-Memory

1-315. Nethra Imaging, Inc., Ultra-Low-Power High Definition 1080p60

1-316. NewTek, New Stereoscopic Features and Interactive Production Workflow

1-317. NEXX Systems, Inc., 3D packaging tool technology

1-318. NEXX Systems, Inc., High Density 3D through-silicon-vias (TSVs).

1-319. Novas Software, Inc., Siloti(TM) Visibility Enhancement (VE) software

1-320. Novelics, portfolio with coolSRAM-6T embedded memory IP and MemQuest compiler

1-321. Novelics, MemQuestTM, a Suite of Memory Compilers Built on a Common Platform

1-322. Numonyx B.V., Phase Change Memory Technology

1-323. NXP, World's Smallest Logic Package With the Largest Pads

1-324. NXP, 3D for NXP Set-Top Box platform

1-325. NXP, GPS/GSM-based Toll System

1-326. Oasys Design Systems, New Chip Synthesis(TM) Platform

1-327. Oasys Design Systems, Synthesizes 100-Million-Gate Chips

1-328. Objective Interface Systems, Inc., ORBexpress communications middleware framework

1-329. Objective Interface Systems, Inc., ORBexpress(R) Communications Middleware

1-330. Integrated Switching Buck Regulators with Industry Leading Conversion Ratios

1-331. ON Semiconductor, BelaSigna R261 High Performance Voice Capture System-on-Chip

1-332. ON Semiconductor, XPressArray-II (XPA-II)

1-333. Panasonic Corporation, smart TVs with 1.4GHz Cortex-A9 SoC

1-334. Panasonic Corporation, ARM for a smart TV system-on-chip

1-335. Panasonic Corporation, Leading-Edge SoC Process Technologies

1-336. Phase One A/S, Sensor+ CCD Technology

1-337. Pixelworks, Inc., Network-On-Chip (NoC) Interconnect Fabric IP

1-338. Pixelworks, Inc., New Generation of ImageProcessor ICs Products

1-339. Planar Systems, Inc., Clarity RP and RX Rear-projection Displays

1-340. PositiveID Corporation, GlucoChip Membrane

1-341. PositiveID Corporation, Glucose-sensing RFID Microchip

1-342. Powervation, digital power IC solutions

1-343. QPC Lasers, Inc., High-brightness, High-power Semiconductor Chip-based Lasers

1-344. Qualcomm Atheros Inc., Embedded Video-over-Wi-Fi Solution

1-345. Qualcomm Atheros Inc., AR9390 is a single-chip, dual-band 11n 3x3

1-346. Qualcomm Atheros Inc., World’s First Complete 10G EPON SoC Solution

1-347. Qualcomm Atheros Inc., World's Most Integrated Single-Chip 802.11g Access Point Solution

1-348. Rambus Inc., CryptoFirewall™ Technology Builds Momentum for Advanced Video Security

1-349. Rambus Inc., advanced differential signaling for SoC-to-memory interfaces

1-350. Rambus Inc., Mobile XDR(TM) Memory for Next-Generation Mobile Products

1-351. Real Intent Software, Advanced Sign-Off Verification Capabilities

1-352. Real Intent Software, Verification Software With World-Class Debug Software

1-353. Real Intent, Inc., Meridian CDC(TM) Software

1-354. RedMere, Ultra-thin Portable Micro-HDMI

1-355. Redpine Signals, Inc., Industry's First Simultaneous Dual-band 2.4GHz 802.11n/BT4.0

1-356. Low-Power 802.11n Wi-Fi? I/O Connectivity for PSoC? 3 and PSoC 5 Platforms

1-357. Redpine Signals, Inc., Lite-NMAX(TM) ultra low power 802.11n Wi-Fi(R)

1-358. RedShift Systems, Thermal Light ValveTM(TLV) Technology

1-359. Renesas Electronics Corporation, High-Performance and Compact SoC

1-360. Renesas Electronics Corporation, Cat-4 150Mbps LTE Downlink Throughput

1-361. Renesas Electronics Corporation, First Integrated LTE Triple-Mode Platform

1-362. Renesas Electronics Corporation, Next Generation SoCs

1-363. Renesas Technology Corp., 200MHz SuperH Chip for Powertrain Systems

1-364. RF Digital, World's First Wi-Fi(R) Module

1-365. RFaxis, Advanced Wireless Three-in-One Solution

1-366. RFaxis, Four Fundamental Patents for Its Disruptive Single-Chip

1-367. RFaxis, RF Front-end Integrated Circuits

1-368. Samsung Electronics, Co., Ltd, High-K Metal Gate Logic Process and Design Ecosystem

1-369. Sandbridge Technologies, SB3000(R) series SOC platform

1-370. Corporation, Breakthrough, System-on-a-Chip (SoC) for Next-Generation Embedded Systems

1-371. Sarnoff Corporation, High Performance, Low Energy Consumption SoC

1-372. Scintera Networks, Inc., Integrated Dual-RMS RF Power Measurement Unit

1-373. Scintera Networks, Inc., 50k units of its RF PA predistortion linearizer SoC

1-374. Adaptive RF Power Amplifier Linearizer (RFPAL) system-on-chip (SoC)

1-375. Sensor System Solutions, Inc., Acquired Social Networks Development Company

1-376. Sensor System Solutions, Inc., Sensor Signal Conditioner

1-377. Sequans Communications, Second generation LTE semiconductor technology

1-378. Sequans Communications, next-generation FDD and TDD LTE chips and global LTE platforms

1-379. Sequans Communications, WiMAXsystem-on-chip Technology

1-380. Sequence Design, Inc., SMMART (Sequence Macro Modeling using Advanced Region Technique)

1-381. Shrink Nanotechnologies, Inc., ShrinkChip Rapid Prototyping System (RPS)

1-382. Sidense Corp., Logic Non-Volatile Memory (LNVM) one-time programmable(OTP) memory IP cores

1-383. Sidense Corp., Embedded Non-Volatile Memory (NVM) Products

1-384. SiEnergy Systems, LLC, Breakthrough Solid Oxide Fuel Cell (SOFC)

1-385. Sigma Designs, Connected media platforms

1-386. Sigma Designs, MIMO 기술을 사용한 혁신적 new ClearPath 기술

1-387. Sigma Designs, Inc., SMP8656 Secure Media Processor(TM)

1-388. Sigma Designs, Inc., VXP image-processing technology

1-389. Sigma Designs, Z-Wave Solutions for Home Entertainment Networking

1-390. Sigma Designs, Inc., Revolutionary Powerline Communications Technology With MIMO

1-391. Sigma Designs, Advanced Video and Networking Technologies

1-392. analog and mixed-signal IC products to complement Freescale's multimedia portfolio

1-393. SigmaTel Inc., System-on-chip Controllers

1-394. Silicon & Software Systems Ltd. (S3), Software Modem System-on-Chip Design

1-395. Silicon & Software Systems Ltd. (S3), Baseband ADC and Power Management Solutio